Kingston DDR3 Industrial BGA DIMM

Kingston DRAM components are designed to meet the needs of embedded applications and offer a low-voltage option for lower power consumption. Available in DDR3/3L (1600 and 1333Mhz) with ball grid array connectors for embedded assembly. Kingston offer both Wide Temperature (-40C to +95) and Normal Temperature Support (0C to + 95C).

Current status: Available

Technical features

Data Integrity
Data Integrity
Shock and Vibration
Shock and Vibration
Supply Longevity
Supply Longevity

Related services

Controlled BOM
Controlled BOM
Just In Time
Just In Time
Obsolesence Management
Obsolesence Management
Category: Brands: .
  • Double-data-rate architecture: two data transfers per clock cycle  
  • The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture
  • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver
  • DOS is edge-aligned with data for READS; center-aligned with data for WRITES
  • Differential clock inputs (CK and !CK)
  • DLL aligns DQ and DOS transitions with CK transitions
  • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
  • Data mask (DM) for write data
  • Posted /CAS by programmable additive latency for better command and data bus efficiency
  • On-Die Termination (ODD for better signal quality — Synchronous ODT — Dynamic CDT Asynchronous ODT
  • Multi Purpose Register (MPR) for pre-defined pattern read out
  • ZQ calibration for DO drive and ODT • Programmable Partial Array Self-Refresh (PASR)
  • RESET pin for Power-up sequence and reset function
  • SRT range: Normal/extended
  • Programmable Output driver impedance control
DDR3/3L PN Capacity Description Package size Organization (words x bits) Speed Mbps VDD, VDDQ Operating Temp.
D2516EC4BXGGB 4Gb 96 ball FBGA DDR3/3L 9.0×13.5×1.2 256MX16 1600/1333 1.35V* 0°C ~ +95°C
D5128EETBPGGBU 4Gb 78 ball FBGA DDR3/3L 9.0×10.6×1.2 512Mx8 1600/1333 1.35V* 0°C ~ +95°C
Temp DDR3/3L PN Capacity Description Package size Configuration (words x bits) Speed Mbps VDD, VDDQ Operating Temp.
D2516EC4BXGGBI 4Gb 96 ball FBGA DDR3/3L IT 9.0×13.5×1.2 256MX16 1600/1333 1.35V* -40°C ~ +95°C
D5128EC4BPGGBUI 4Gb 78 ball FBGA DDR3/3L IT 9.0×10.6×1.2 512Mx8 1600/1333 1.35V* -40°C ~ +95°C




Form Factor


Operating Temperature

Standard 0°C to +70°C, Wide -40°C to +85°C


184 Pin

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