Innodisk issue PCN for DDR3 from Micron DDR3 512M*8 E-die W.T IC to Micron DDR3 512M*8 P-die W.T IC

Key Characteristics of the Change:Base on Innodisk product management, Innodisk hereby to announce the product plan change for all of Micron DDR3512Mx8 W.T IC assembled modules. Description:Innodisk is going to process Micron DDR3 512Mx8 E-Die W.T base density product termination and change to MicronDDR3 512Mx8 P-Die W.T base product series. Products include:Embedded Series (Long DIMM […]

PCN issued from Innodisk for DDR2 product change notices from Samsung DDR2 64M*8 Q-die to Samsung 64M*8 N-die

Key Characteristics of the Change:Base on Innodisk product management, Innodisk hereby to announce the product plan change for all of Samsung DDR264Mx8 IC assembled modules. Description:Innodisk is going to process Samsung DDR2 64Mx8 Q-Die base density product termination and running change toSamsung DDR2 64Mx8 N-Die base product series. Included  products:Embedded Series (Long DIMM / SO-DIMM) […]

PCN issued from Innodisk for Samsung DDR2 128M*8 G-die IC to Samsung DDR2 128M*8 J-die IC

Key Characteristics of the Change: Product plan change for all of Samsung DDR2 128Mx8 IC assembled modules. Innodisk is going to process Samsung DDR2 128Mx8 G-Die base density product termination and change to Samsung DDR2 128Mx8 J-Die base product series. include below products: Embedded Series (Long DIMM / SO-DIMM) of DDR2 DRAM Modules. Embedded Low-profile Series […]