Kingston I-Temp DDR3/3L DRAM

Ideal for embedded applications, Kingston’s I-Temp DRAM meets industrial operating temperature requirements (-40°C~+95°C) which makes it suitable for outdoor and harsh  environments. It supports both low (1.35V) and standard (1.5V) voltage for design flexibility.

Current status: Available

Technical features

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• Double-data-rate architecture: two data transfers per clock cycle
• High-speed data transfer is realized by 8 bits prefetch pipelined architecture
• Bi-directional di erential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver
• DOS is edge-aligned with data for READS; center-aligned with data for WRITES
• Di erential clock inputs (CK and /CK)
• DLL aligns DQ and DOS transitions with CK transitions
• Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
• Data mask (DM) for write data
• Posted /CAS by programmable additive latency for better command and data bus e ciency
• On-Die Termination (ODD for better signal quality)
— Synchronous ODT
— Dynamic CDT
— Asynchronous ODT
• Multi Purpose Register (MPR) for pre-de ned pattern read out
• ZQ calibration for DO drive and ODT
• Programmable Partial Array Self-Refresh (PASR)
• RESET pin for Power-up sequence and reset function
• SRT range: Normal/extended
• Programmable Output driver impedance control

I-Temp 30nm DDR3/3L PN

CapacityDescriptionPackage Size

Configuration (words x bits) 

Speed MbpsVVD, VDDQOperating Temp
D2516EC4BXGGBI4Gb96 ball FBGA
DDR3/3L I-Temp
9.0×13.5×1.2256M x 1616001.35V*-40°C to 95°C
D5128EC4BPGGBUI4Gb78 ball FBGA
DDR3/3L I-Temp
9.0×13.5×1.2512M x 816001.35V*-40°C to 95°C
D2516ECMDXGJDI4Gb96 ball FBGA
DDR3/3L I-Temp
9.0×13.5×1.2256M x 1618661.35V*-40°C to 95°C
D5128ECMDPGJDI4Gb78 ball FBGA
DDR3/3L I-Temp
9.0×13.5×1.2512M x 818661.35V*-40°C to 95°C

*Backward compatible to 1.5V VDD, VDDQ

Capacity

Form Factor

Operating Temperature

Interface

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