Tech Talk

The Thermal Experts in Storage and Memory Solutions


Last updated 11 February 2026

Simms & ATP: Engineering Performance Without Thermal Compromise

In industrial and embedded environments, temperature is not a background condition - it is a defining factor of performance.

From sub-zero edge deployments to high-density computing platforms operating in extreme heat, storage devices must deliver sustained throughput without throttling, instability, or premature wear. At Simms International, we recognise that achieving this level of reliability requires deep thermal expertise. That is why our collaboration with ATP Electronics - globally recognised as “The Thermal Experts in Storage and Memory Solutions” - is so powerful.

A Foundation Built on Industrial-Temperature Innovation

ATP was among the earliest pioneers in developing industrial-temperature (I-Temp) 3D NAND flash storage, engineered specifically for extreme operating conditions. Unlike commercial-grade storage limited to typical indoor environments, industrial deployments often demand operation from -40°C to +85°C and beyond.

At these extremes, NAND behaviour changes significantly. Latency profiles shift. Error rates increase. Endurance characteristics evolve. Sustaining performance under these conditions requires far more than component selection - it requires intelligent engineering across firmware, controller architecture, and validation.

This legacy of I-Temp innovation laid the groundwork for ATP’s continued leadership in thermal management - a capability that has only grown more critical in the NVMe era.

Example of industrial-rated modules engineered for wide temperature and rugged applications

NVMe Performance: Speed Generates Heat

Modern NVMe SSDs deliver exceptional performance, enabling AI acceleration, industrial automation, defence systems, medical platforms, and edge analytics. But higher throughput and greater power density naturally generate heat - particularly in compact embedded systems with limited airflow.

Without advanced thermal management, high-speed NVMe modules risk:

  • Performance throttling
  • Reduced endurance
  • Data integrity concerns
  • Unpredictable workload behaviour

ATP addresses this challenge through an integrated thermal engineering approach - combining advanced heatsink designs, adaptive multi-stage thermal throttling algorithms, and application-specific optimisation.

This is not reactive cooling. It is proactive thermal architecture.

A Thermal Task Force Mindset

While not branded as a formal team, ATP operates with what can best be described as a thermal task force mentality - where hardware engineering, firmware development, and validation processes are aligned around sustained performance in harsh environments.

Through our partnership, Simms works closely with ATP’s engineering capabilities to tailor solutions based on real-world deployment conditions:

  • Customisable heatsinks and thermal materials
  • Firmware tuned for workload-specific thermal balancing
  • Industrial-grade validation for extreme environments
  • System-level optimisation for enclosure and airflow constraints

This collaborative model ensures that storage solutions are not simply fast on paper - but stable and predictable over time.

Sustained Performance, Not Just Peak Performance

In mission-critical applications, peak speed means little if it cannot be maintained. The true measure of storage performance is consistency under load, across temperature ranges, and over extended operational life.

By combining ATP’s globally recognised thermal leadership with Simms’ customer-centric engineering expertise, we deliver storage and memory solutions designed to thrive where others falter.

Because in harsh environments, performance is not about how fast you can go - it’s about how long you can sustain it.